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Rochester Electronics IHW25N120R2FKSA1
Manufacturer # :IHW25N120R2FKSA1
Manufacturer :Rochester Electronics
Dasenic # :IHW25N120R2FKSA1-DS
Datasheet : IHW25N120R2FKSA1 Datasheet
Customer # :
Description : IGBT 1200V 50A 365W TO247-3
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 2117
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 8.28
Total :$ 8.28
Delivery :
Payment :
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IHW25N120R2FKSA1 information
Rochester Electronics IHW25N120R2FKSA1 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 175°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-247-3
- Input Type:Standard
- Power - Max:365 W
- Supplier Device Package:PG-TO247-3-1
- Reverse Recovery Time (trr):-
- Current - Collector ( Ic) ( Max):50 A
- Voltage - Collector Emitter Breakdown ( Max):1200 V
- I G B T Type:NPT
- Vce(on) ( Max) @ Vge, Ic:1.8V @ 15V, 25A
- Current - Collector Pulsed ( Icm):75 A
- Switching Energy:1.59mJ
- Gate Charge:60.7 nC
- Td (on/off) @ 25° C:-/324ns
- Test Condition:600V, 25A, 10Ohm, 15V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
IHW25N120R2FKSA1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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