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Rochester Electronics HGT1S7N60C3D

Name: HGT1S7N60C3D
Brand: Rochester Electronics
SKU: HGT1S7N60C3D-DS
Price: 1.1962 USD
Availability: InStock
Rating: 4.8 (42 reviews)

In Stock: 11646

MOQ: 1

4 Price Tiers

Mfr.Part # :HGT1S7N60C3D
Manufacturer :Rochester Electronics
Dasenic # :HGT1S7N60C3D-DS
Datasheet : HGT1S7N60C3D Datasheet PDF
Description : IGBT, 14A, 600V, N-CHANNEL
Package :-
Unit Price: $1.1962
Total: $1.20

Quantity	Unit Price	You Save
1-10	$1.1962	-
11-339	$0.9968	16.7% save
340-500	$0.9544	20.2% save
501-1000	$0.9014	24.6% save

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Rochester Electronics HGT1S7N60C3D technical specifications, attributes, parameters.

Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single

Product Status:Active

Operating Temperature:-40°C ~ 150°C (TJ)

Mounting Type:Through Hole

Package / Case:TO-262-3 Long Leads, I²Pak, TO-262AA

Input Type:Standard

Power - Max:60 W

Supplier Device Package:I2PAK (TO-262)

Reverse Recovery Time (trr):25 ns

Current - Collector ( Ic) ( Max):14 A

Voltage - Collector Emitter Breakdown ( Max):600 V

I G B T Type:-

Vce(on) ( Max) @ Vge, Ic:2V @ 15V, 7A

Current - Collector Pulsed ( Icm):56 A

Switching Energy:-

Gate Charge:38 nC

Td (on/off) @ 25° C:-

Test Condition:-

EU RoHS Status:ROHS3 Compliant

MSL Rating:1 (Unlimited, 30°C/85%RH)

REACH Status:Vendor omitted MSL Rating information

US ECCN:EAR99

HTS US:8541.29.0095

China RoHS Status:Green Symbol: Green and environmentally friendly product

HGT1S7N60C3D provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester oﬀers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.