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Rochester Electronics ADMP510ACEZ-RL7

RF HARDENED, ULTRALOW NOISE MICR
part number has RoHS
Manufacturer # :ADMP510ACEZ-RL7
Manufacturer :Rochester Electronics
Dasenic # :ADMP510ACEZ-RL7-DS
Customer # :
Description : RF HARDENED, ULTRALOW NOISE MICR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 2.0610$ 2.06
25+$ 2.0160$ 50.4
100+$ 1.9350$ 193.5
500+$ 1.8540$ 927
1000+$ 1.7550$ 1755
In Stock: 4323
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 2.061
Total :$ 2.06
Delivery :
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Payment :
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ADMP510ACEZ-RL7 information

  • Rochester Electronics ADMP510ACEZ-RL7 technical specifications, attributes, parameters.
  • Category:Audio Components/Microphones
  • Product Status:Active
  • Voltage - Rated:-
  • Ratings:-
  • Size / Dimension:0.132" L x 0.098" W (3.35mm x 2.50mm)
  • Voltage Range:1.5 V ~ 3.3 V
  • Current - Supply:250 µA
  • Port Location:Bottom
  • Termination:Solder Pads
  • Type:MEMS (Silicon)
  • Impedance:350 Ohms
  • Output Type:Analog
  • Direction:Omnidirectional
  • Frequency Range:60 Hz ~ 20 kHz
  • Sensitivity:-38dB ±2dB @ 94dB SPL
  • S/ N Ratio:65dB
  • Height ( Max):0.039" (0.98mm)
  • Shape:Rectangular
  • US ECCN:EAR99
  • HTS US:8518.10.8030
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ADMP510ACEZ-RL7 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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