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Visual inspection: Use a magnifying glass or microscope to observe the appearance of components and identify obvious mechanical damage, scratches, contamination, pin deformation and other problems.

Automated optical inspection (AOI):Use machine vision technology to automatically detect the appearance defects of components.

Parameter test: Use special test equipment to measure key parameters such as resistance, capacitance, inductance, forward voltage drop of diodes, gain (hFE) of transistors, and IC functions to ensure that they are within the specified range.

Functional test: Perform comprehensive functional tests on complex components (such as integrated circuits) to verify that all their designed functions are functioning properly.

Temperature cycle test: Expose components to extreme temperature conditions (high temperature, low temperature) to check whether their performance is affected.

Humidity test: Test the tolerance of components in high humidity environments to evaluate whether they have problems such as moisture absorption and leakage.

Salt spray test: Used to evaluate the corrosion resistance of components, especially metal parts exposed to salt spray.

Vibration and shock test: Simulate the mechanical stress that components may encounter during transportation and use to ensure their reliability under vibration and shock conditions.

High temperature aging test:Components are operated continuously for a certain period of time under high temperature conditions, and their performance changes are observed to accelerate the aging process.

Load life test: The components are operated for a long time under rated load conditions, and their performance changes over time are recorded to predict the service life.

MTBF (Mean Time Between Failures) test: Estimates the failure-free time of components under normal working conditions through statistical methods.

HALT (Highly Accelerated Life Test): Discovers potential design and manufacturing defects by applying extreme stresses (such as temperature and vibration).

HAST (Highly Accelerated Stress Test): Accelerated stress testing is performed in a high temperature and high humidity environment to evaluate the early failure mode of components.

X-ray analysis:Check the internal structure of components, such as solder joints, packaging quality, and identify internal defects.

Scanning electron microscope (SEM): Used to observe the surface morphology and fault structure of materials.

Energy dispersive X-ray spectroscopy (EDX): Analyze the composition of materials and identify whether there are harmful elements or impurities.

ESD test: simulates electrostatic discharge events to check whether components can withstand electrostatic shocks of a certain intensity without being damaged.

EOS test: applies excessive voltage or current to test the overstress resistance of components.

Sampling inspection: Randomly select samples from mass-produced components for comprehensive testing to ensure that they meet quality standards.

Statistical process control (SPC): Monitor key parameters in the production process through statistical methods to ensure product consistency and stability.