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Rochester Electronics IRG4IBC20UDPBF
Manufacturer # :IRG4IBC20UDPBF
Manufacturer :Rochester Electronics
Dasenic # :IRG4IBC20UDPBF-DS
Datasheet : IRG4IBC20UDPBF Datasheet
Customer # :
Description : IGBT, 11.4A, 600V, N-CHANNEL
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 41431
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.8375
Total :$ 0.84
Delivery :
Payment :
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IRG4IBC20UDPBF information
Rochester Electronics IRG4IBC20UDPBF technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Active
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-220-3 Full Pack
- Input Type:Standard
- Power - Max:34 W
- Supplier Device Package:TO-220AB Full-Pak
- Reverse Recovery Time (trr):37 ns
- Current - Collector ( Ic) ( Max):11.4 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- I G B T Type:-
- Vce(on) ( Max) @ Vge, Ic:2.1V @ 15V, 6.5A
- Current - Collector Pulsed ( Icm):52 A
- Switching Energy:160µJ (on), 130µJ (off)
- Gate Charge:27 nC
- Td (on/off) @ 25° C:39ns/93ns
- Test Condition:480V, 6.5A, 50Ohm, 15V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:0000.00.0000
- China RoHS Status:Green Symbol: Green and environmentally friendly product
IRG4IBC20UDPBF provided by Rochester Electronics
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Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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