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1 : $416.6600
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Rochester Electronics KAI-0330-ABA-CB-BA-DUAL
IMAGE SENSOR CCD VGA DUAL 20CDIP
Manufacturer # :KAI-0330-ABA-CB-BA-DUAL
Manufacturer :Rochester Electronics
Dasenic # :KAI-0330-ABA-CB-BA-DUAL-DS
Datasheet :
KAI-0330-ABA-CB-BA-DUAL Datasheet
KAI-0330-ABA-CB-BA-DUAL DatasheetCustomer # :
Description : IMAGE SENSOR CCD VGA DUAL 20CDIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 416.6600 | $ 416.66 |
| 25+ | $ 408.3200 | $ 10208 |
| 100+ | $ 391.6600 | $ 39166 |
| 500+ | $ 375.0000 | $ 187500 |
| 1000+ | $ 354.1600 | $ 354160 |
In Stock: 1501
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 416.66
Total :$ 416.66
Delivery :
Payment :
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KAI-0330-ABA-CB-BA-DUAL information
Rochester Electronics KAI-0330-ABA-CB-BA-DUAL technical specifications, attributes, parameters.
- Category:Sensor Devices/Optical Sensors - Image Sensors, Camera
- Product Status:Obsolete
- Operating Temperature:40°C (TJ)
- Package / Case:20-CDIP Module
- Type:CCD
- Supplier Device Package:20-CDIP
- Voltage - Supply:12V ~ 15.5V
- Frames per Second:120
- Pixel Size:9µm x 9µm
- Active Pixel Array:648H x 484V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
KAI-0330-ABA-CB-BA-DUAL provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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