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Rochester Electronics FSGM0565RBLDTU
Manufacturer # :FSGM0565RBLDTU
Manufacturer :Rochester Electronics
Dasenic # :FSGM0565RBLDTU-DS
Datasheet : FSGM0565RBLDTU Datasheet
Customer # :
Description : IC OFFLINE SW FLBACK TO220F-6L
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 26103
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.6629
Total :$ 0.66
Delivery :
Payment :
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FSGM0565RBLDTU information
Rochester Electronics FSGM0565RBLDTU technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - AC DC Converters, Offline Switchers
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-220-6 Full Pack, Formed Leads
- Supplier Device Package:TO-220F-6L (W-Forming)
- Voltage - Breakdown:650V
- Power ( Watts):80 W
- Internal Switch(s):Yes
- Voltage - Supply ( Vcc/ Vdd):7.5V ~ 26V
- Frequency - Switching:66kHz
- Output Isolation:Isolated
- Topology:Flyback
- Voltage - Start Up:12 V
- Duty Cycle:70%
- Fault Protection:Current Limiting, Over Load, Over Temperature, Over Voltage, Short Circuit
- Control Features:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Affected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
FSGM0565RBLDTU provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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