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Rochester Electronics CD74HCT137M

INVERTING 3-TO-8 LINE DECODER
part number has RoHS
Manufacturer # :CD74HCT137M
Manufacturer :Rochester Electronics
Dasenic # :CD74HCT137M-DS
Customer # :
Description : INVERTING 3-TO-8 LINE DECODER
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.3380$ 0.34
25+$ 0.3313$ 8.28
100+$ 0.3178$ 31.78
500+$ 0.3042$ 152.1
1000+$ 0.2874$ 287.4
In Stock: 3462
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.338
Total :$ 0.34
Delivery :
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Payment :
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CD74HCT137M information

  • Rochester Electronics CD74HCT137M technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Signal Switches, Multiplexers, Decoders
  • Product Status:Active
  • Operating Temperature:-55°C ~ 125°C
  • Mounting Type:Surface Mount
  • Package / Case:16-SOIC (0.154", 3.90mm Width)
  • Type:Decoder/Demultiplexer
  • Supplier Device Package:16-SOIC
  • Voltage - Supply:4.5V ~ 5.5V
  • Voltage Supply Source:Single Supply
  • Current - Output High, Low:4mA, 4mA
  • Circuit:1 x 3:8
  • Independent Circuits:1
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:Vendor omitted MSL Rating information
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CD74HCT137M provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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