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Rochester Electronics BC817DPN/DG/B3115
Manufacturer # :BC817DPN/DG/B3115
Manufacturer :Rochester Electronics
Dasenic # :BC817DPN/DG/B3115-DS
Datasheet : BC817DPN/DG/B3115 Datasheet
Customer # :
Description : NOW NEXPERIA BC817 - SMALL SIGNA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 6000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.041
Total :$ 0.04
Delivery :
Payment :
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BC817DPN/DG/B3115 information
Rochester Electronics BC817DPN/DG/B3115 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Arrays
- Product Status:Active
- Operating Temperature:150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:SC-74, SOT-457
- Power - Max:370mW
- Supplier Device Package:6-TSOP
- Transistor Type:NPN, PNP
- Current - Collector ( Ic) ( Max):500mA
- Voltage - Collector Emitter Breakdown ( Max):45V
- Vce Saturation ( Max) @ Ib, Ic:700mV @ 50mA, 500mA
- Current - Collector Cutoff ( Max):100nA (ICBO)
- D C Current Gain (h F E) ( Min) @ Ic, Vce:160 @ 100mA, 1V
- Frequency - Transition:100MHz, 80MHz
- EU RoHS Status:Vendor omitted MSL Rating information
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.21.0095
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BC817DPN/DG/B3115 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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