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  • Rochester Electronics KSC1623LMTF-FS

    0.1A, 50V, NPN
  • part number has RoHS
  • Mfr.Part # :KSC1623LMTF-FS
  • Manufacturer :Rochester Electronics
  • Dasenic # :KSC1623LMTF-FS-DS
  • Datasheet :pdf download KSC1623LMTF-FS Datasheet
  • Description : 0.1A, 50V, NPN
  • Package :-
  • Quantity :
    Unit Price : $ 0.12Total : $ 0.12
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
    dhlupsfedex
  • Payment :
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In Stock: 1452
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
10 +$ 0.1200$ 1.20
11539 +$ 0.0600$ 692.34

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Rochester Electronics KSC1623LMTF-FS technical specifications, attributes, parameters.
Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Arrays
Product Status:Active
Operating Temperature:150°C (TJ)
Mounting Type:Surface Mount
Package / Case:TO-236-3, SC-59, SOT-23-3
Power - Max:200mW
Supplier Device Package:SOT-23-3
Transistor Type:NPN
Current - Collector ( Ic) ( Max):100mA
Voltage - Collector Emitter Breakdown ( Max):50V
Vce Saturation ( Max) @ Ib, Ic:300mV @ 10mA, 100mA
Current - Collector Cutoff ( Max):100nA (ICBO)
D C Current Gain (h F E) ( Min) @ Ic, Vce:300 @ 1mA, 6V
Frequency - Transition:250MHz
EU RoHS Status:RoHS3(EU 2015/863)
MSL Rating:1 (Unlimited, 30°C/85%RH)
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
KSC1623LMTF-FS provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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