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Rochester Electronics 9111DC

R-S FLIP-FLOP
part number has RoHS
Manufacturer # :9111DC
Manufacturer :Rochester Electronics
Dasenic # :9111DC-DS
Customer # :
Description : R-S FLIP-FLOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 10.7820$ 10.78
25+$ 10.5660$ 264.15
100+$ 10.1340$ 1013.4
500+$ 9.7020$ 4851
1000+$ 9.1620$ 9162
In Stock: 5274
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 10.782
Total :$ 10.78
Delivery :
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Payment :
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9111DC information

  • Rochester Electronics 9111DC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Flip Flops
  • Product Status:Active
  • Operating Temperature:0°C ~ 75°C
  • Mounting Type:Through Hole
  • Package / Case:14-CDIP (0.300", 7.62mm)
  • Type:D-Type
  • Output Type:Complementary
  • Supplier Device Package:14-CDIP
  • Number of Elements:1
  • Voltage - Supply:-
  • Clock Frequency:-
  • Number of Bits per Element:1
  • Current - Output High, Low:-
  • Max Propagation Delay @ V, Max C L:-
  • Current - Quiescent ( Iq):-
  • Trigger Type:Positive Edge
  • Input Capacitance:-
  • Function:Standard
  • EU RoHS Status:RoHS non-compliant
  • MSL Rating:2 (1 Year,30°C/60%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
9111DC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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