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Onsemi MT9M114EBLSTCZ-CR1

SENSOR IMAGE 1MP CMOS 55ODCSP
part number has RoHS
Manufacturer # :MT9M114EBLSTCZ-CR1
Manufacturer :Onsemi
Dasenic # :MT9M114EBLSTCZ-CR1-DS
Customer # :
Description : SENSOR IMAGE 1MP CMOS 55ODCSP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 6.9300$ 6.93
10+$ 5.1750$ 51.75
480+$ 4.9950$ 2397.6
960+$ 4.6530$ 4466.88
In Stock: 1804
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 6.93
Total :$ 6.93
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MT9M114EBLSTCZ-CR1 information

  • Onsemi MT9M114EBLSTCZ-CR1 technical specifications, attributes, parameters.
  • Category:Sensor Devices/Optical Sensors - Image Sensors, Camera
  • Product Status:Active
  • Operating Temperature:-30°C ~ 70°C
  • Package / Case:55-WFBGA
  • Type:CMOS
  • Supplier Device Package:55-ODCSP (4.62x3.82)
  • Voltage - Supply:1.7V ~ 3.1V
  • Frames per Second:120
  • Pixel Size:1.9µm x 1.9µm
  • Active Pixel Array:1296H x 976V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MT9M114EBLSTCZ-CR1 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management, Signal Conditioning & Control, Sensors, Motor Control, Custom & ASSP, Interfaces, Wireless Connectivity, Timing, Logic & Memory. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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