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Onsemi BC856BDW1T1
Manufacturer # :BC856BDW1T1
Manufacturer :Onsemi
Dasenic # :BC856BDW1T1-DS
Datasheet : BC856BDW1T1 Datasheet
Customer # :
Description : TRANS 2PNP 65V 0.1A SOT363
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In Stock: 7740
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0558
Total :$ 0.06
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BC856BDW1T1 information
Onsemi BC856BDW1T1 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Arrays
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:6-TSSOP, SC-88, SOT-363
- Power - Max:380mW
- Supplier Device Package:SC-88/SC70-6/SOT-363
- Transistor Type:2 PNP (Dual)
- Current - Collector ( Ic) ( Max):100mA
- Voltage - Collector Emitter Breakdown ( Max):65V
- Vce Saturation ( Max) @ Ib, Ic:650mV @ 5mA, 100mA
- Current - Collector Cutoff ( Max):15nA (ICBO)
- D C Current Gain (h F E) ( Min) @ Ic, Vce:220 @ 2mA, 5V
- Frequency - Transition:100MHz
- EU RoHS Status:RoHS non-compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.21.0075
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
BC856BDW1T1 provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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