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1 : $107.6000
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Onsemi AR0220AT4R00XUEA1-TPBM
2MP 1/2 CIS SO
Manufacturer # :AR0220AT4R00XUEA1-TPBM
Manufacturer :Onsemi
Dasenic # :AR0220AT4R00XUEA1-TPBM-DS
Datasheet :
AR0220AT4R00XUEA1-TPBM Datasheet
AR0220AT4R00XUEA1-TPBM DatasheetCustomer # :
Description : 2MP 1/2 CIS SO
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 107.6000 | $ 107.6 |
In Stock: 651
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 107.6
Total :$ 107.60
Delivery :
Payment :
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AR0220AT4R00XUEA1-TPBM information
Onsemi AR0220AT4R00XUEA1-TPBM technical specifications, attributes, parameters.
- Category:Sensor Devices/Optical Sensors - Image Sensors, Camera
- Product Status:Active
- Operating Temperature:-40°C ~ 105°C (TA)
- Package / Case:87-LBGA
- Type:CMOS
- Supplier Device Package:87-IBGA (12x9)
- Voltage - Supply:1.14V ~ 1.26V
- Frames per Second:60
- Pixel Size:4.2µm x 4.2µm
- Active Pixel Array:1820H x 940V
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
AR0220AT4R00XUEA1-TPBM provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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