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Texas Instruments TMX320C28343ZHH
Manufacturer # :TMX320C28343ZHH
Manufacturer :Texas Instruments
Dasenic # :TMX320C28343ZHH-DS
Datasheet : TMX320C28343ZHH Datasheet
Customer # :
Description : IC MCU 32BIT ROMLESS 179BGA
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In Stock: 2497
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 55.52
Total :$ 55.52
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TMX320C28343ZHH information
Texas Instruments TMX320C28343ZHH technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Discontinued at Digi-Key
- Operating Temperature:-40°C ~ 105°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:179-LFBGA
- Type:Floating Point
- Interface:CAN, EBI/EMI, I²C, McBSP, SCI, SPI
- Supplier Device Package:179-BGA MicroStar (12x12)
- Clock Rate:200MHz
- Non- Volatile Memory:ROM (16kB)
- On- Chip R A M:260kB
- Voltage - I/ O:3.30V
- Voltage - Core:1.10V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
TMX320C28343ZHH provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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