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Texas Instruments THS7375IPW
Manufacturer # :THS7375IPW
Manufacturer :Texas Instruments
Dasenic # :THS7375IPW-DS
Datasheet : THS7375IPW Datasheet
Customer # :
Description : IC AMP BUFFER 14TSSOP
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In Stock: 7560
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.8374
Total :$ 0.84
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THS7375IPW information
Texas Instruments THS7375IPW technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Linear - Amplifiers - Video Amps and Modules
- Product Status:Active
- Mounting Type:Surface Mount
- Package / Case:14-TSSOP (0.173", 4.40mm Width)
- Current - Supply:10.3 mA
- Output Type:Rail-to-Rail
- Supplier Device Package:14-TSSOP
- Number of Circuits:4
- -3db Bandwidth:9.5 MHz
- Current - Output / Channel:90 mA
- Slew Rate:150V/µs
- Voltage - Supply, Single/ Dual (±):2.85V ~ 5.5V
- Applications:Buffer
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
THS7375IPW provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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