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Texas Instruments DM6446ANB6C2127VC

IC SOC DIGITAL MEDIA 361NFBGA
part number has RoHS
Manufacturer # :DM6446ANB6C2127VC
Manufacturer :Texas Instruments
Dasenic # :DM6446ANB6C2127VC-DS
Customer # :
Description : IC SOC DIGITAL MEDIA 361NFBGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
90+$ 95.1867$ 8566.8
In Stock: 1499
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 95.1867
Total :$ 95.19
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DM6446ANB6C2127VC information

  • Texas Instruments DM6446ANB6C2127VC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Not For New Designs
  • Operating Temperature:0°C ~ 85°C (TC)
  • Mounting Type:Surface Mount
  • Package / Case:361-LFBGA
  • Type:Digital Media System-on-Chip (DMSoC)
  • Interface:ASP, EBI/EMI, Host Interface, I²C, SPI, UART, USB
  • Supplier Device Package:361-NFBGA (16x16)
  • Clock Rate:594MHz DSP, 297MHz ARM®
  • Non- Volatile Memory:ROM (8kB)
  • On- Chip R A M:160kB
  • Voltage - I/ O:1.8V, 3.3V
  • Voltage - Core:1.20V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
DM6446ANB6C2127VC provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips. TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems. We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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