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Texas Instruments CDCLVC1103PWR
Manufacturer # :CDCLVC1103PWR
Manufacturer :Texas Instruments
Dasenic # :CDCLVC1103PWR-DS
Datasheet : CDCLVC1103PWR Datasheet
Customer # :
Description : IC CLK BUFFER 1:3 250MHZ 8TSSOP
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In Stock: 6304
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0.8427
Total :$ 0.84
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CDCLVC1103PWR information
Texas Instruments CDCLVC1103PWR technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Clock/Timing - Clock Buffers, Drivers
- Product Status:Active
- Operating Temperature:-40°C ~ 85°C
- Mounting Type:Surface Mount
- Package / Case:8-TSSOP (0.173", 4.40mm Width)
- Type:Fanout Buffer (Distribution)
- Supplier Device Package:8-TSSOP
- Frequency - Max:250 MHz
- Number of Circuits:1
- Output:LVCMOS
- Voltage - Supply:2.3V ~ 3.6V
- Input:LVCMOS
- Ratio - Input: Output:1:3
- Differential - Input: Output:No/No
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
CDCLVC1103PWR provided by Texas Instruments
Founded in 1930,Texas Instruments (Nasdaq: TXN) is a global semiconductor company that designs, manufactures, tests and sells analog and embedded processing chips.
TI's product range spans from low-power, low-cost devices to high-performance, specialized solutions. With approximately 80,000 products, including microcontrollers, analog-to-digital converters (ADCs), digital-to-analog converters (DACs), operational amplifiers (op-amps), power management ICs, and more, we help over 100,000 customers efficiently manage power, accurately sense and transmit data and provide the core control or processing in their designs, going into markets such as industrial, automotive, personal electronics, communications equipment and enterprise systems.
We have a long history of globally owned, regionally diverse internal manufacturing operations, including 15 manufacturing sites worldwide, with 12 wafer fabs, seven assembly and test factories, and multiple bump and probe facilities.
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