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Rochester Electronics TEA1533AP/N1,112
Manufacturer # :TEA1533AP/N1,112
Manufacturer :Rochester Electronics
Dasenic # :TEA1533AP/N1,112-DS
Datasheet : TEA1533AP/N1,112 Datasheet
Customer # :
Description : IC OFFLINE SWITCH FLYBACK 8DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1544
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.5265
Total :$ 0.53
Delivery :
Payment :
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TEA1533AP/N1,112 information
Rochester Electronics TEA1533AP/N1,112 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - AC DC Converters, Offline Switchers
- Product Status:Obsolete
- Operating Temperature:-20°C ~ 145°C (TJ)
- Mounting Type:Through Hole
- Package / Case:8-DIP (0.300", 7.62mm)
- Supplier Device Package:8-DIP
- Voltage - Breakdown:650V
- Power ( Watts):250 W
- Internal Switch(s):No
- Voltage - Supply ( Vcc/ Vdd):8.7V ~ 20V
- Frequency - Switching:25kHz ~ 175kHz
- Output Isolation:Isolated
- Topology:Flyback
- Voltage - Start Up:11 V
- Duty Cycle:-
- Fault Protection:Current Limiting, Over Power, Over Temperature, Over Voltage, Short Circuit
- Control Features:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TEA1533AP/N1,112 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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