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Rochester Electronics RJP2557DPK-E

HIGH SPEED IGBT, 270V, 50A
part number has RoHS
Manufacturer # :RJP2557DPK-E
Manufacturer :Rochester Electronics
Dasenic # :RJP2557DPK-E-DS
Customer # :
Description : HIGH SPEED IGBT, 270V, 50A
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 4.4820$ 4.48
25+$ 4.3920$ 109.8
100+$ 4.2120$ 421.2
500+$ 4.0320$ 2016
1000+$ 3.8070$ 3807
In Stock: 1708
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.482
Total :$ 4.48
Delivery :
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  • Rochester Electronics RJP2557DPK-E technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
  • Product Status:Active
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Input Type:-
  • Power - Max:-
  • Supplier Device Package:-
  • Reverse Recovery Time (trr):-
  • Current - Collector ( Ic) ( Max):-
  • Voltage - Collector Emitter Breakdown ( Max):-
  • I G B T Type:-
  • Vce(on) ( Max) @ Vge, Ic:-
  • Current - Collector Pulsed ( Icm):-
  • Switching Energy:-
  • Gate Charge:-
  • Td (on/off) @ 25° C:-
  • Test Condition:-
  • EU RoHS Status:RoHS Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • HTS US:8541.30.0080
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
RJP2557DPK-E provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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