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Rochester Electronics NCP1079BAP130G
Manufacturer # :NCP1079BAP130G
Manufacturer :Rochester Electronics
Dasenic # :NCP1079BAP130G-DS
Datasheet : NCP1079BAP130G Datasheet
Customer # :
Description : IC OFFLINE SWITCH FLYBACK 8DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 27743
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.08
Total :$ 1.08
Delivery :
Payment :
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NCP1079BAP130G information
Rochester Electronics NCP1079BAP130G technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/PMIC - AC DC Converters, Offline Switchers
- Product Status:Active
- Operating Temperature:-40°C ~ 125°C (TJ)
- Mounting Type:Through Hole
- Package / Case:8-DIP (0.300", 7.62mm), 7 Leads
- Supplier Device Package:8-PDIP
- Voltage - Breakdown:700V
- Power ( Watts):41 W
- Internal Switch(s):Yes
- Voltage - Supply ( Vcc/ Vdd):6.5V ~ 20V
- Frequency - Switching:130kHz
- Output Isolation:Isolated
- Topology:Flyback
- Voltage - Start Up:8.4 V
- Duty Cycle:68%
- Fault Protection:Current Limiting, Over Power, Over Temperature, Over Voltage, Short Circuit
- Control Features:-
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:Vendor omitted MSL Rating information
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
NCP1079BAP130G provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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