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Rochester Electronics MDB1900ZBQZY01

ZERO DELAY BUFFER FOR PCIE
part number has RoHS
Manufacturer # :MDB1900ZBQZY01
Manufacturer :Rochester Electronics
Dasenic # :MDB1900ZBQZY01-DS
Customer # :
Description : ZERO DELAY BUFFER FOR PCIE
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 3.4650$ 3.47
25+$ 3.3930$ 84.83
100+$ 3.2490$ 324.9
500+$ 3.1140$ 1557
1000+$ 2.9430$ 2943
In Stock: 4536
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3.465
Total :$ 3.46
Delivery :
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Payment :
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MDB1900ZBQZY01 information

  • Rochester Electronics MDB1900ZBQZY01 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Application Specific
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:72-VFQFN Exposed Pad
  • Supplier Device Package:72-QFN (10x10)
  • Frequency - Max:133.33MHz
  • Number of Circuits:1
  • Output:HCSL
  • Voltage - Supply:2.375V ~ 3.465V
  • P L L:Yes with Bypass
  • Input:HCSL
  • Ratio - Input: Output:2:3
  • Differential - Input: Output:Yes/Yes
  • Main Purpose:PCI Express (PCIe), SATA CPU
  • EU RoHS Status:RoHS Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MDB1900ZBQZY01 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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