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Rochester Electronics MC10EL32DG

IC DIVIDER DIV X2 ECL DIFF 8SOIC
part number has RoHS
Manufacturer # :MC10EL32DG
Manufacturer :Rochester Electronics
Dasenic # :MC10EL32DG-DS
Customer # :
Description : IC DIVIDER DIV X2 ECL DIFF 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 4.2210$ 4.22
25+$ 4.1400$ 103.5
100+$ 3.9690$ 396.9
500+$ 3.7980$ 1899
1000+$ 3.5910$ 3591
In Stock: 5724
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.221
Total :$ 4.22
Delivery :
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Payment :
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MC10EL32DG information

  • Rochester Electronics MC10EL32DG technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Counters, Dividers
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Direction:Up
  • Supplier Device Package:8-SOIC
  • Number of Elements:1
  • Voltage - Supply:4.2 V ~ 5.7 V
  • Logic Type:Divide-by-2
  • Number of Bits per Element:1
  • Reset:Asynchronous
  • Timing:-
  • Count Rate:3 GHz
  • Trigger Type:Positive, Negative
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
MC10EL32DG provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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