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Rochester Electronics FZ1000R33HL3BPSA1

IGBT MOD 3300V 1000A 1600W
part number has RoHS
Manufacturer # :FZ1000R33HL3BPSA1
Manufacturer :Rochester Electronics
Dasenic # :FZ1000R33HL3BPSA1-DS
Customer # :
Description : IGBT MOD 3300V 1000A 1600W
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
2+$ 3260.4000$ 6520.8
In Stock: 2670
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 3260.4
Total :$ 3260.40
Delivery :
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FZ1000R33HL3BPSA1 information

  • Rochester Electronics FZ1000R33HL3BPSA1 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - IGBTs - Modules
  • Product Status:Active
  • Operating Temperature:-40°C ~ 150°C
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Power - Max:1600 W
  • Supplier Device Package:Module
  • Configuration:Single Switch
  • Input:Standard
  • Current - Collector ( Ic) ( Max):1000 A
  • Voltage - Collector Emitter Breakdown ( Max):3300 V
  • Current - Collector Cutoff ( Max):5 mA
  • I G B T Type:Trench Field Stop
  • Vce(on) ( Max) @ Vge, Ic:2.85V @ 15V, 1000A
  • Input Capacitance ( Cies) @ Vce:190 nF @ 25 V
  • N T C Thermistor:No
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FZ1000R33HL3BPSA1 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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