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Rochester Electronics FS3L30R07W2H3FB11BPSA2

IGBT MOD 650V 30A 20MW
part number has RoHS
Manufacturer # :FS3L30R07W2H3FB11BPSA2
Manufacturer :Rochester Electronics
Dasenic # :FS3L30R07W2H3FB11BPSA2-DS
Customer # :
Description : IGBT MOD 650V 30A 20MW
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 51.3270$ 51.33
In Stock: 1560
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 51.327
Total :$ 51.33
Delivery :
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FS3L30R07W2H3FB11BPSA2 information

  • Rochester Electronics FS3L30R07W2H3FB11BPSA2 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - IGBTs - Modules
  • Product Status:Active
  • Operating Temperature:-40°C ~ 150°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Power - Max:20 mW
  • Supplier Device Package:Module
  • Configuration:Three Phase Inverter
  • Input:Standard
  • Current - Collector ( Ic) ( Max):30 A
  • Voltage - Collector Emitter Breakdown ( Max):650 V
  • Current - Collector Cutoff ( Max):1 mA
  • I G B T Type:Trench Field Stop
  • Vce(on) ( Max) @ Vge, Ic:1.9V @ 15V, 30A
  • Input Capacitance ( Cies) @ Vce:1.65 nF @ 25 V
  • N T C Thermistor:Yes
  • EU RoHS Status:RoHS Compliant
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
FS3L30R07W2H3FB11BPSA2 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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