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Rochester Electronics DS1691

IC RTC CLK/CALENDAR PAR 28-EDIP
part number has RoHS
Manufacturer # :DS1691
Manufacturer :Rochester Electronics
Dasenic # :DS1691-DS
Customer # :
Description : IC RTC CLK/CALENDAR PAR 28-EDIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 14.0220$ 14.02
25+$ 13.7430$ 343.58
100+$ 13.1850$ 1318.5
500+$ 12.6180$ 6309
1000+$ 11.9160$ 11916
In Stock: 1902
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 14.022
Total :$ 14.02
Delivery :
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DS1691 information

  • Rochester Electronics DS1691 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Real Time Clocks
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C
  • Features:Alarm, Leap Year, Square Wave Output, Unique ID
  • Mounting Type:Through Hole
  • Package / Case:28-DIP Module (0.600", 15.24mm)
  • Type:Clock/Calendar
  • Interface:Parallel
  • Supplier Device Package:28-EDIP
  • Memory Size:114B
  • Voltage - Supply:2.7V ~ 3.3V, 4.5V ~ 5.5V
  • Time Format:HH:MM:SS (12/24 hr)
  • Date Format:YY-MM-DD
  • Voltage - Supply, Battery:-
  • Current - Timekeeping ( Max):-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
DS1691 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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