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Rochester Electronics DS1315SN-33

IC RTC PHANTOM PAR 16-SOIC
part number has RoHS
Manufacturer # :DS1315SN-33
Manufacturer :Rochester Electronics
Dasenic # :DS1315SN-33-DS
Customer # :
Description : IC RTC PHANTOM PAR 16-SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 21.5000$ 21.5
25+$ 21.0800$ 527
100+$ 20.2200$ 2022
500+$ 19.3600$ 9680
1000+$ 18.2800$ 18280
In Stock: 1506
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 21.5
Total :$ 21.50
Delivery :
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Payment :
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DS1315SN-33 information

  • Rochester Electronics DS1315SN-33 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Clock/Timing - Real Time Clocks
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Features:Leap Year
  • Mounting Type:Surface Mount
  • Package / Case:16-SOIC (0.295", 7.50mm Width)
  • Type:Phantom Time Chip
  • Interface:Parallel
  • Supplier Device Package:16-SOIC
  • Memory Size:-
  • Voltage - Supply:3V ~ 3.6V
  • Time Format:HH:MM:SS:hh (12/24 hr)
  • Date Format:YY-MM-DD-dd
  • Voltage - Supply, Battery:2.5V ~ 3.7V
  • Current - Timekeeping ( Max):1.1mA @ 3.3V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
DS1315SN-33 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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