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Rochester Electronics CY7C1399B-10ZCT

CACHE SRAM, 32KX8, 10NS PDSO28
part number has RoHS
Manufacturer # :CY7C1399B-10ZCT
Manufacturer :Rochester Electronics
Dasenic # :CY7C1399B-10ZCT-DS
Customer # :
Description : CACHE SRAM, 32KX8, 10NS PDSO28
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.6451$ 0.65
25+$ 0.6323$ 15.81
100+$ 0.6064$ 60.64
500+$ 0.5806$ 290.3
1000+$ 0.5484$ 548.4
In Stock: 36000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.6451
Total :$ 0.65
Delivery :
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Payment :
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  • Rochester Electronics CY7C1399B-10ZCT technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Memory Integrated Circuit
  • Product Status:Active
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:28-TSSOP (0.465", 11.80mm Width)
  • Technology:SRAM - Asynchronous
  • Supplier Device Package:28-TSOP I
  • Memory Size:256Kb (32K x 8)
  • Memory Type:Volatile
  • Voltage - Supply:3V ~ 3.6V
  • Clock Frequency:-
  • Access Time:10 ns
  • Memory Format:SRAM
  • Memory Interface:Parallel
  • Write Cycle Time - Word, Page:10ns
  • EU RoHS Status:RoHS Compliant
  • MSL Rating:3 (168 Hours,30°C/60%RH)
  • REACH Status:REACH is not affected
  • US ECCN:EAR99
  • HTS US:8542.32.0041
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY7C1399B-10ZCT provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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