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Rochester Electronics CY37256VP256-100BGC

IC CPLD 256MC 12NS 292BGA
part number has RoHS
Manufacturer # :CY37256VP256-100BGC
Manufacturer :Rochester Electronics
Dasenic # :CY37256VP256-100BGC-DS
Customer # :
Description : IC CPLD 256MC 12NS 292BGA
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 18.6030$ 18.6
25+$ 18.2340$ 455.85
100+$ 17.4870$ 1748.7
500+$ 16.7400$ 8370
1000+$ 15.8130$ 15813
In Stock: 3342
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 18.603
Total :$ 18.60
Delivery :
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Payment :
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CY37256VP256-100BGC information

  • Rochester Electronics CY37256VP256-100BGC technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - CPLDs (Complex Programmable Logic Devices)
  • Product Status:Obsolete
  • Operating Temperature:0°C ~ 70°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:292-BGA
  • Supplier Device Package:292-PBGA (27x27)
  • Programmable Type:In-System Reprogrammable™ (ISR™) CMOS
  • Delay Time tpd(1) Max:12 ns
  • Voltage Supply - Internal:3V ~ 3.6V
  • Number of Logic Elements/ Blocks:-
  • Number of Macrocells:256
  • Number of I/ O:197
  • Number of gates:-
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
CY37256VP256-100BGC provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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