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Rochester Electronics BQ4850YMA-85N

IC RTC CLK/CALENDAR PAR 32-DIP
part number has RoHS
Manufacturer # :BQ4850YMA-85N
Manufacturer :Rochester Electronics
Dasenic # :BQ4850YMA-85N-DS
Customer # :
Description : IC RTC CLK/CALENDAR PAR 32-DIP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 67.1040$ 67.1
25+$ 65.7630$ 1644.08
100+$ 63.0810$ 6308.1
500+$ 60.3900$ 30195
1000+$ 57.0420$ 57042
In Stock: 6516
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 67.104
Total :$ 67.10
Delivery :
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  • Rochester Electronics BQ4850YMA-85N technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Real Time Clocks
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C
  • Features:Alarm
  • Mounting Type:Through Hole
  • Package / Case:32-DIP Module (0.61", 15.49mm)
  • Type:Clock/Calendar
  • Interface:Parallel
  • Supplier Device Package:32-DIP Module (18.42x52.96)
  • Memory Size:-
  • Voltage - Supply:4.5V ~ 5.5V
  • Time Format:HH:MM:SS (24 hr)
  • Date Format:YY-MM-DD-dd
  • Voltage - Supply, Battery:-
  • Current - Timekeeping ( Max):1mA @ 4.5V ~ 5.5V
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
BQ4850YMA-85N provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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