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Rochester Electronics ADBF561WBBZ505
BLACKFIN DUAL CORE PROCESSOR 533
Manufacturer # :ADBF561WBBZ505
Manufacturer :Rochester Electronics
Dasenic # :ADBF561WBBZ505-DS
Datasheet :
ADBF561WBBZ505 Datasheet
ADBF561WBBZ505 DatasheetCustomer # :
Description : BLACKFIN DUAL CORE PROCESSOR 533
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 0.0090 | $ 0.01 |
| 10+ | $ 0.0090 | $ 0.09 |
| 100+ | $ 0.0090 | $ 0.9 |
| 500+ | $ 0.0090 | $ 4.5 |
| 1000+ | $ 0.0090 | $ 9 |
In Stock: 26899
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.009
Total :$ 0.01
Delivery :
Payment :
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ADBF561WBBZ505 information
Rochester Electronics ADBF561WBBZ505 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:297-BGA
- Type:Fixed Point
- Interface:SPI, SSP, UART
- Supplier Device Package:297-PBGA (27x27)
- Clock Rate:533MHz
- Non- Volatile Memory:External
- On- Chip R A M:328kB
- Voltage - I/ O:3.30V
- Voltage - Core:1.25V
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
ADBF561WBBZ505 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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