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Rochester Electronics ADBF549WBBCZ5M03

BLACKFIN 533MHZ PRCRSR 2 PPI USB
part number has RoHS
Manufacturer # :ADBF549WBBCZ5M03
Manufacturer :Rochester Electronics
Dasenic # :ADBF549WBBCZ5M03-DS
Customer # :
Description : BLACKFIN 533MHZ PRCRSR 2 PPI USB
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 28.4760$ 28.48
25+$ 27.9090$ 697.73
100+$ 26.7660$ 2676.6
500+$ 25.6320$ 12816
1000+$ 24.2010$ 24201
In Stock: 3288
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 28.476
Total :$ 28.48
Delivery :
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Payment :
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ADBF549WBBCZ5M03 information

  • Rochester Electronics ADBF549WBBCZ5M03 technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Embedded - DSP (Digital Signal Processors)
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:400-LFBGA, CSPBGA
  • Type:Fixed Point
  • Interface:CAN, EBI/EMI, SD/SDIO, SPI, SPORT, TWI, UART/USART, USB OTG
  • Supplier Device Package:400-CSPBGA (17x17)
  • Clock Rate:533MHz
  • Non- Volatile Memory:External
  • On- Chip R A M:260kB
  • Voltage - I/ O:3.30V
  • Voltage - Core:1.19V
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
ADBF549WBBCZ5M03 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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