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Rochester Electronics AD7706BRU-REEL
Manufacturer # :AD7706BRU-REEL
Manufacturer :Rochester Electronics
Dasenic # :AD7706BRU-REEL-DS
Datasheet : AD7706BRU-REEL Datasheet
Customer # :
Description : IC ADC 16BIT 3CH 16-TSSOP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 8709
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 5.463
Total :$ 5.46
Delivery :
Payment :
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Rochester Electronics AD7706BRU-REEL technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Analog to Digital Converters (ADC)
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 85°C
- Features:PGA
- Mounting Type:Surface Mount
- Package / Case:16-TSSOP (0.173", 4.40mm Width)
- Input Type:Pseudo-Differential
- Supplier Device Package:16-TSSOP
- Configuration:MUX-PGA-ADC
- Sampling Rate ( Per Second):500
- Data Interface:SPI, DSP
- Number of Bits:16
- Voltage - Supply, Analog:2.7V ~ 3.3V, 5V
- Voltage - Supply, Digital:2.7V ~ 3.3V, 5V
- Number of Inputs:3
- Ratio - S/ H: A D C:-
- Number of A/ D Converters:1
- Architecture:Sigma-Delta
- Reference Type:External
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
AD7706BRU-REEL provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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