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Rochester Electronics NC7SP58P6X

TINYLOGIC ULP UNIVERSAL CONFIGUR
part number has RoHS
Manufacturer # :NC7SP58P6X
Manufacturer :Rochester Electronics
Dasenic # :NC7SP58P6X-DS
Customer # :
Description : TINYLOGIC ULP UNIVERSAL CONFIGUR
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 0.0615$ 0.06
25+$ 0.0602$ 1.51
100+$ 0.0578$ 5.78
500+$ 0.0554$ 27.7
1000+$ 0.0523$ 52.3
In Stock: 9000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0615
Total :$ 0.06
Delivery :
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Payment :
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NC7SP58P6X information

  • Rochester Electronics NC7SP58P6X technical specifications, attributes, parameters.
  • Category:Integrated Circuits (ICs)/Logic - Gates and Inverters - Multi-Function, Configurable
  • Product Status:Active
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:6-TSSOP, SC-88, SOT-363
  • Output Type:Single-Ended
  • Supplier Device Package:SC-88 (SC-70-6)
  • Number of Circuits:1
  • Voltage - Supply:0.9V ~ 3.6V
  • Number of Inputs:3
  • Logic Type:Configurable Multiple Function
  • Current - Output High, Low:2.6mA, 2.6mA
  • Schmitt Trigger Input:No
  • EU RoHS Status:ROHS3 Compliant
  • MSL Rating:1 (Unlimited, 30°C/85%RH)
  • REACH Status:REACH Unaffected
  • US ECCN:EAR99
  • HTS US:8542.39.0001
  • China RoHS Status:Green Symbol: Green and environmentally friendly product
NC7SP58P6X provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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