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Onsemi MCH5541-TL-E
Manufacturer # :MCH5541-TL-E
Manufacturer :Onsemi
Dasenic # :MCH5541-TL-E-DS
Datasheet : MCH5541-TL-E Datasheet
Customer # :
Description : TRANS NPN/PNP 30V 0.7A 6MCPH
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In Stock: 3000
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
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Unit Price :$ 0
Total :$ 0.00
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MCH5541-TL-E information
Onsemi MCH5541-TL-E technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Arrays
- Product Status:Active
- Operating Temperature:150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:6-SMD (5 Leads), Flat Lead
- Power - Max:500mW
- Supplier Device Package:5-MCPH
- Transistor Type:NPN, PNP (Emitter Coupled)
- Current - Collector ( Ic) ( Max):700mA
- Voltage - Collector Emitter Breakdown ( Max):30V
- Vce Saturation ( Max) @ Ib, Ic:190mV @ 10mA, 200mA, 220mV @ 10mA, 200mA
- Current - Collector Cutoff ( Max):100nA (ICBO)
- D C Current Gain (h F E) ( Min) @ Ic, Vce:300 @ 50mA, 2V
- Frequency - Transition:540MHZ, 520MHz
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
MCH5541-TL-E provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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