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Onsemi MC14175BFELG
Manufacturer # :MC14175BFELG
Manufacturer :Onsemi
Dasenic # :MC14175BFELG-DS
Datasheet : MC14175BFELG Datasheet
Customer # :
Description : IC FF D-TYPE SNGL 4BIT 16SOEIAJ
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In Stock: 6000
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.2745
Total :$ 0.27
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MC14175BFELG information
Onsemi MC14175BFELG technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Logic - Flip Flops
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:16-SOIC (0.209", 5.30mm Width)
- Type:D-Type
- Output Type:Complementary
- Supplier Device Package:16-SOEIAJ
- Number of Elements:1
- Voltage - Supply:3V ~ 18V
- Clock Frequency:14 MHz
- Number of Bits per Element:4
- Current - Output High, Low:8.8mA, 8.8mA
- Max Propagation Delay @ V, Max C L:120ns @ 15V, 50pF
- Current - Quiescent ( Iq):20 µA
- Trigger Type:Positive Edge
- Input Capacitance:5 pF
- Function:Reset
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8542.39.0001
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
MC14175BFELG provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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