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Rochester Electronics FMG2G200US60

IGBT, 200A, 600V, N-CHANNEL
part number has RoHS
Manufacturer # :FMG2G200US60
Manufacturer :Rochester Electronics
Dasenic # :FMG2G200US60-DS
Customer # :
Description : IGBT, 200A, 600V, N-CHANNEL
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
10+$ 115.0000$ 1150
In Stock: 2529
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 115
Total :$ 115.00
Delivery :
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Payment :
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FMG2G200US60 information

  • Rochester Electronics FMG2G200US60 technical specifications, attributes, parameters.
  • Category:Discrete Semiconductor Devices/Transistors - IGBTs - Modules
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 150°C (TJ)
  • Mounting Type:Chassis Mount
  • Package / Case:7PM-HA
  • Power - Max:695 W
  • Supplier Device Package:7PM-HA
  • Configuration:Half Bridge
  • Input:Standard
  • Current - Collector ( Ic) ( Max):200 A
  • Voltage - Collector Emitter Breakdown ( Max):600 V
  • Current - Collector Cutoff ( Max):250 µA
  • I G B T Type:-
  • Vce(on) ( Max) @ Vge, Ic:2.7V @ 15V, 200A
  • Input Capacitance ( Cies) @ Vce:-
  • N T C Thermistor:No
  • EU RoHS Status:ROHS3 Compliant
  • US ECCN:EAR99
  • HTS US:8541.29.0095
  • REACH Status:Vendor is not defined
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
FMG2G200US60 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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