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Onsemi EC4H09C-TL-H
Manufacturer # :EC4H09C-TL-H
Manufacturer :Onsemi
Dasenic # :EC4H09C-TL-H-DS
Datasheet : EC4H09C-TL-H Datasheet
Customer # :
Description : RF TRANS NPN 3.5V 26GHZ ECSP1008
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In Stock: 44400
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.5947
Total :$ 0.59
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EC4H09C-TL-H information
Onsemi EC4H09C-TL-H technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - RF
- Product Status:Obsolete
- Operating Temperature:150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:4-UFDFN
- Power - Max:120mW
- Supplier Device Package:4-ECSP1008
- Transistor Type:NPN
- Current - Collector ( Ic) ( Max):40mA
- Voltage - Collector Emitter Breakdown ( Max):3.5V
- D C Current Gain (h F E) ( Min) @ Ic, Vce:70 @ 5mA, 1V
- Frequency - Transition:26GHz
- Noise Figure (d B Typ @ f):1.3dB @ 2GHz
- Gain:15dB
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.21.0075
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
EC4H09C-TL-H provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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