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Onsemi 2SB1302S-TD-E
Manufacturer # :2SB1302S-TD-E
Manufacturer :Onsemi
Dasenic # :2SB1302S-TD-E-DS
Datasheet : 2SB1302S-TD-E Datasheet
Customer # :
Description : TRANS PNP 20V 5A PCP
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In Stock: 9600
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0438
Total :$ 0.04
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2SB1302S-TD-E information
Onsemi 2SB1302S-TD-E technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Single
- Product Status:Obsolete
- Operating Temperature:150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:TO-243AA
- Power - Max:1.3 W
- Supplier Device Package:PCP
- Transistor Type:PNP
- Current - Collector ( Ic) ( Max):5 A
- Voltage - Collector Emitter Breakdown ( Max):20 V
- Vce Saturation ( Max) @ Ib, Ic:500mV @ 60mA, 3A
- Current - Collector Cutoff ( Max):500nA (ICBO)
- D C Current Gain (h F E) ( Min) @ Ic, Vce:100 @ 500mA, 2V
- Frequency - Transition:320MHz
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
2SB1302S-TD-E provided by Onsemi
Founded in 1999,ON Semiconductor (Nasdaq: ON) focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure.
Onsemi offers a diverse portfolio of semiconductor products, including Discrete & Power Modules,Power Management,
Signal Conditioning & Control,
Sensors,
Motor Control,
Custom & ASSP,
Interfaces,
Wireless Connectivity,
Timing, Logic & Memory.
With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
Headquartered in Arizona, USA, the company has a robust infrastructure that includes an extensive network of 19 manufacturing sites, 43 design centers, and 8 solution engineering centers.
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