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Diotec Semiconductor BC849C
TRANS NPN 30V 0.1A SOT23-3
Manufacturer # :BC849C
Manufacturer :Diotec Semiconductor
Dasenic # :BC849C-DS
Datasheet :
BC849C Datasheet
BC849C DatasheetCustomer # :
Description : TRANS NPN 30V 0.1A SOT23-3
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 10+ | $ 0.0265 | $ 0.27 |
| 3000+ | $ 0.0147 | $ 44.1 |
| 6000+ | $ 0.0131 | $ 78.6 |
| 9000+ | $ 0.0121 | $ 108.9 |
| 15000+ | $ 0.0110 | $ 165 |
In Stock: 12265
MOQ :1 PCS
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Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0.0265
Total :$ 0.03
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BC849C information
Diotec Semiconductor BC849C technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - Bipolar (BJT) - Single
- Product Status:Active
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:TO-236-3, SC-59, SOT-23-3
- Power - Max:250 mW
- Supplier Device Package:SOT-23-3 (TO-236)
- Transistor Type:NPN
- Current - Collector ( Ic) ( Max):100 mA
- Voltage - Collector Emitter Breakdown ( Max):30 V
- Vce Saturation ( Max) @ Ib, Ic:600mV @ 5mA, 100mA
- Current - Collector Cutoff ( Max):15nA (ICBO)
- D C Current Gain (h F E) ( Min) @ Ic, Vce:420 @ 2mA, 5V
- Frequency - Transition:300MHz
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- US ECCN:EAR99
- HTS US:8541.21.0075
- REACH Status:REACH is not affected
- China RoHS Status:Green Symbol: Green and environmentally friendly product
BC849C provided by Diotec Semiconductor
Diotec Semiconductor AG belongs to the technological leaders for the design and production of semiconductor components like Diodes, Rectifiers, Schottkys, Zeners, TVS, BJTs and MOSFETs. The Diotec brand offers more than 6,000 different products with production facilities in Germany, Slovenia, China and India. Diotec’s products are used from customers in the electronics field throughout the world.
Our core strength is the extensive know-how from wafer production via chip manufacturing to product assembly and test. Our headquarters are in the very south-west of Germany, close to the city of Freiburg. Beside production, we develop and build in that place manufacturing lines and test equipment for our facilities.
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