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  • Rochester Electronics XC4062XL-1BG560C

    IC FPGA 384 I/O 560MBGA
  • part number has RoHS
  • Mfr.Part # :XC4062XL-1BG560C
  • Manufacturer :Rochester Electronics
  • Dasenic # :XC4062XL-1BG560C-DS
  • Datasheet :pdf download XC4062XL-1BG560C Datasheet
  • Description : IC FPGA 384 I/O 560MBGA
  • Package :-
  • Quantity :
    Unit Price : $ 464.8613Total : $ 464.86
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 1637
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 464.8613$ 464.86
25 +$ 455.5688$ 11389.22
100 +$ 436.9725$ 43697.25
500 +$ 418.3763$ 209188.15
1000 +$ 395.1338$ 395133.80

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Rochester Electronics XC4062XL-1BG560C technical specifications, attributes, parameters.
Category:Integrated Circuits (ICs)/FPGAs (Field Programmable Gate Array)
Product Status:Obsolete
Operating Temperature:0°C ~ 85°C (TJ)
Mounting Type:Surface Mount
Package / Case:560-LBGA Exposed Pad, Metal
Supplier Device Package:560-MBGA (42.5x42.5)
Voltage - Supply:3V ~ 3.6V
Number of I/ O:384
Number of L A Bs/ C L Bs:2304
Number of Logic Elements/ Cells:5472
Number of gates:62000
Total R A M bits:73728
EU RoHS Status:RoHS Compliant
REACH Status:REACH is not affected
US ECCN:EAR99
China RoHS Status:Green Symbol: Green and environmentally friendly product
XC4062XL-1BG560C provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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