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1 : $42.2820
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Rochester Electronics OR2C15A4PS208-DB
FPGA, 400 CLBS, 19200 GATES
Manufacturer # :OR2C15A4PS208-DB
Manufacturer :Rochester Electronics
Dasenic # :OR2C15A4PS208-DB-DS
Datasheet :
OR2C15A4PS208-DB Datasheet
OR2C15A4PS208-DB DatasheetCustomer # :
Description : FPGA, 400 CLBS, 19200 GATES
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 42.2820 | $ 42.28 |
| 25+ | $ 41.4360 | $ 1035.9 |
| 100+ | $ 39.7440 | $ 3974.4 |
| 500+ | $ 38.0520 | $ 19026 |
| 1000+ | $ 35.9370 | $ 35937 |
In Stock: 5964
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 42.282
Total :$ 42.28
Delivery :
Payment :
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OR2C15A4PS208-DB information
Rochester Electronics OR2C15A4PS208-DB technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:-
- Mounting Type:-
- Package / Case:-
- Supplier Device Package:-
- Voltage - Supply:-
- Number of I/ O:-
- Number of L A Bs/ C L Bs:-
- Number of Logic Elements/ Cells:-
- Number of gates:-
- Total R A M bits:-
- EU RoHS Status:RoHS non-compliant
- MSL Rating:3 (168 Hours,30°C/60%RH)
- REACH Status:Vendor omitted MSL Rating information
- US ECCN:EAR99
- HTS US:8542.39.0001
- China RoHS Status:Green Symbol: Green and environmentally friendly product
OR2C15A4PS208-DB provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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