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1 : $50.0220
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Rochester Electronics EPF6010ATC144-1
IC FPGA 102 I/O 144TQFP
Manufacturer # :EPF6010ATC144-1
Manufacturer :Rochester Electronics
Dasenic # :EPF6010ATC144-1-DS
Datasheet :
EPF6010ATC144-1 Datasheet
EPF6010ATC144-1 DatasheetCustomer # :
Description : IC FPGA 102 I/O 144TQFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 50.0220 | $ 50.02 |
| 25+ | $ 49.0230 | $ 1225.58 |
| 100+ | $ 47.0250 | $ 4702.5 |
| 500+ | $ 45.0180 | $ 22509 |
| 1000+ | $ 42.5160 | $ 42516 |
In Stock: 3264
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 50.022
Total :$ 50.02
Delivery :
Payment :
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EPF6010ATC144-1 information
Rochester Electronics EPF6010ATC144-1 technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Active
- Operating Temperature:0°C ~ 85°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:144-LQFP
- Supplier Device Package:144-TQFP (20x20)
- Voltage - Supply:3V ~ 3.6V
- Number of I/ O:102
- Number of L A Bs/ C L Bs:88
- Number of Logic Elements/ Cells:880
- Number of gates:10000
- Total R A M bits:-
- EU RoHS Status:RoHS Compliant
- REACH Status:Vendor is not defined
- US ECCN:Provided as per user requirements
- China RoHS Status:Green Symbol: Green and environmentally friendly product
EPF6010ATC144-1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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