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1 : $58.2210
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Rochester Electronics XC4028XL-3HQ208I
IC FPGA 160 I/O 208QFP
Manufacturer # :XC4028XL-3HQ208I
Manufacturer :Rochester Electronics
Dasenic # :XC4028XL-3HQ208I-DS
Datasheet :
XC4028XL-3HQ208I Datasheet
XC4028XL-3HQ208I DatasheetCustomer # :
Description : IC FPGA 160 I/O 208QFP
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 1+ | $ 58.2210 | $ 58.22 |
| 25+ | $ 57.0600 | $ 1426.5 |
| 100+ | $ 54.7290 | $ 5472.9 |
| 500+ | $ 52.3980 | $ 26199 |
| 1000+ | $ 49.4910 | $ 49491 |
In Stock: 1623
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 58.221
Total :$ 58.22
Delivery :
Payment :
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XC4028XL-3HQ208I information
Rochester Electronics XC4028XL-3HQ208I technical specifications, attributes, parameters.
- Category:Integrated Circuits (ICs)/Embedded - FPGAs (Field Programmable Gate Array)
- Product Status:Obsolete
- Operating Temperature:-40°C ~ 100°C (TJ)
- Mounting Type:Surface Mount
- Package / Case:208-BFQFP Exposed Pad
- Supplier Device Package:208-PQFP (28x28)
- Voltage - Supply:3V ~ 3.6V
- Number of I/ O:160
- Number of L A Bs/ C L Bs:1024
- Number of Logic Elements/ Cells:2432
- Number of gates:28000
- Total R A M bits:32768
- EU RoHS Status:RoHS Compliant
- REACH Status:REACH is not affected
- US ECCN:EAR99
- China RoHS Status:Green Symbol: Green and environmentally friendly product
XC4028XL-3HQ208I provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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