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  • Rochester Electronics TMP37GT9Z

    SENSOR ANALOG 5C-100C TO92-3
  • part number has RoHS
  • Mfr.Part # :TMP37GT9Z
  • Manufacturer :Rochester Electronics
  • Dasenic # :TMP37GT9Z-DS
  • Datasheet :pdf download TMP37GT9Z Datasheet
  • Description : SENSOR ANALOG 5C-100C TO92-3
  • Package :-
  • Quantity :
    Unit Price : $ 0.6825Total : $ 0.68
  • Delivery Time :Ship Within 48 Hours
  • Shipping Origin :Shenzhen or Hong Kong Warehouse
  • Delivery :
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  • Payment :
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In Stock: 57869
( MOQ : 1 PCS )
Pricing (USD) : * All prices are in USD
QuantityUnit PriceTotal
1 +$ 0.6825$ 0.68
25 +$ 0.6688$ 16.72
100 +$ 0.6415$ 64.15
500 +$ 0.6143$ 307.15
1000 +$ 0.5801$ 580.10

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Rochester Electronics TMP37GT9Z technical specifications, attributes, parameters.
Category:Sensor Devices/Temperature Sensors - Analog and Digital Output
Product Status:Obsolete
Operating Temperature:-40°C ~ 150°C
Features:Shutdown Mode
Mounting Type:Through Hole
Package / Case:TO-226-3, TO-92-3 (TO-226AA)
Output Type:Analog Voltage
Supplier Device Package:TO-92-3
Resolution:20mV/°C
Voltage - Supply:2.7V ~ 5.5V
Sensor Type:Analog, Local
Test Condition:25°C (5°C ~ 100°C)
Sensing Temperature - Local:5°C ~ 100°C
Sensing Temperature - Remote:-
Accuracy - Highest ( Lowest):±3°C (±4°C)
EU RoHS Status:RoHS Compliant
REACH Status:Vendor is not defined
US ECCN:Provided as per user requirements
China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TMP37GT9Z provided by Rochester Electronics

As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.

As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.

Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.

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