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Rochester Electronics TMP06ART-REEL7

IC SENSOR TEMP PWM OUT SOT23-5
part number has RoHS
Manufacturer # :TMP06ART-REEL7
Manufacturer :Rochester Electronics
Dasenic # :TMP06ART-REEL7-DS
Customer # :
Description : IC SENSOR TEMP PWM OUT SOT23-5
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 1.2915$ 1.29
200+$ 0.4998$ 99.96
500+$ 0.4826$ 241.3
1000+$ 0.4739$ 473.9
In Stock: 40
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.2915
Total :$ 1.29
Delivery :
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Payment :
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TMP06ART-REEL7 information

  • Rochester Electronics TMP06ART-REEL7 technical specifications, attributes, parameters.
  • Category:Sensor Devices/Temperature Sensors - Analog and Digital Output
  • Product Status:Obsolete
  • Operating Temperature:-40°C ~ 150°C
  • Features:One-Shot
  • Mounting Type:Surface Mount
  • Package / Case:-
  • Output Type:PWM
  • Supplier Device Package:-
  • Resolution:-
  • Voltage - Supply:3V ~ 5.5V
  • Sensor Type:Digital, Local
  • Test Condition:0°C ~ 70°C (-40°C ~ 150°C)
  • Sensing Temperature - Local:-40°C ~ 150°C
  • Sensing Temperature - Remote:-
  • Accuracy - Highest ( Lowest):±2°C (±5°C)
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TMP06ART-REEL7 provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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