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Rochester Electronics TMP03FS

SENSOR DIGITAL -40C-100C 8SOIC
part number has RoHS
Manufacturer # :TMP03FS
Manufacturer :Rochester Electronics
Dasenic # :TMP03FS-DS
Customer # :
Description : SENSOR DIGITAL -40C-100C 8SOIC
Pricing (USD) : *To apply for a price, please click the Send Target Price button
QuantityUnit PriceTotal
1+$ 4.5360$ 4.54
25+$ 4.4460$ 111.15
100+$ 4.2660$ 426.6
500+$ 4.0860$ 2043
1000+$ 3.8520$ 3852
In Stock: 6285
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 4.536
Total :$ 4.54
Delivery :
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TMP03FS information

  • Rochester Electronics TMP03FS technical specifications, attributes, parameters.
  • Category:Sensor Devices/Temperature Sensors - Analog and Digital Output
  • Product Status:Obsolete
  • Operating Temperature:-55°C ~ 150°C
  • Features:One-Shot
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Output Type:PWM
  • Supplier Device Package:8-SOIC
  • Resolution:-
  • Voltage - Supply:4.5V ~ 7V
  • Sensor Type:Digital, Local
  • Test Condition:-25°C ~ 100°C (-40°C ~ -25°C)
  • Sensing Temperature - Local:-40°C ~ 100°C
  • Sensing Temperature - Remote:-
  • Accuracy - Highest ( Lowest):±4°C (±5°C)
  • EU RoHS Status:RoHS Compliant
  • REACH Status:Vendor is not defined
  • US ECCN:Provided as per user requirements
  • China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
TMP03FS provided by Rochester Electronics
As an original manufacturer stocking distributor, Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors. As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types. Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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