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Rochester Electronics SGP30N60HSXKSA1
IGBT 600V 41A 250W TO220-3
Manufacturer # :SGP30N60HSXKSA1
Manufacturer :Rochester Electronics
Dasenic # :SGP30N60HSXKSA1-DS
Datasheet :
SGP30N60HSXKSA1 Datasheet
SGP30N60HSXKSA1 DatasheetCustomer # :
Description : IGBT 600V 41A 250W TO220-3
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| Quantity | Unit Price | Total |
In Stock: 53
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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SGP30N60HSXKSA1 information
Rochester Electronics SGP30N60HSXKSA1 technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Obsolete
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-220-3
- Input Type:Standard
- Power - Max:250 W
- Supplier Device Package:PG-TO220-3-1
- Reverse Recovery Time (trr):-
- Current - Collector ( Ic) ( Max):41 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- I G B T Type:NPT
- Vce(on) ( Max) @ Vge, Ic:3.15V @ 15V, 30A
- Current - Collector Pulsed ( Icm):112 A
- Switching Energy:1.15mJ
- Gate Charge:141 nC
- Td (on/off) @ 25° C:20ns/250ns
- Test Condition:400V, 30A, 11Ohm, 15V
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:8541.29.0095
- EU RoHS Status:RoHS Compliant
- China RoHS Status:Orange Symbol: Safe for use during the environmental protection period
SGP30N60HSXKSA1 provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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