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Rochester Electronics SGH20N60RUFDTU-FS
Manufacturer # :SGH20N60RUFDTU-FS
Manufacturer :Rochester Electronics
Dasenic # :SGH20N60RUFDTU-FS-DS
Datasheet : SGH20N60RUFDTU-FS Datasheet
Customer # :
Description : IGBT, 32A, 600V, N-CHANNEL
Pricing (USD) : *To apply for a price, please click the Send Target Price button
In Stock: 1138
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 0
Total :$ 0.00
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SGH20N60RUFDTU-FS information
Rochester Electronics SGH20N60RUFDTU-FS technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Active
- Operating Temperature:-55°C ~ 150°C (TJ)
- Mounting Type:Through Hole
- Package / Case:TO-3P-3, SC-65-3
- Input Type:Standard
- Power - Max:195 W
- Supplier Device Package:TO-3P
- Reverse Recovery Time (trr):50 ns
- Current - Collector ( Ic) ( Max):32 A
- Voltage - Collector Emitter Breakdown ( Max):600 V
- I G B T Type:-
- Vce(on) ( Max) @ Vge, Ic:2.8V @ 15V, 20A
- Current - Collector Pulsed ( Icm):60 A
- Switching Energy:524µJ (on), 473µJ (off)
- Gate Charge:80 nC
- Td (on/off) @ 25° C:30ns/48ns
- Test Condition:300V, 20A, 10Ohm, 15V
- EU RoHS Status:ROHS3 Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH Unaffected
- US ECCN:EAR99
- HTS US:0000.00.0000
- China RoHS Status:Green Symbol: Green and environmentally friendly product
SGH20N60RUFDTU-FS provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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