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Rochester Electronics RJP3053DPP-A9#T2F
HIGH SPEED IGBT, 300V, 30A
Manufacturer # :RJP3053DPP-A9#T2F
Manufacturer :Rochester Electronics
Dasenic # :RJP3053DPP-A9#T2F-DS
Datasheet :
RJP3053DPP-A9#T2F Datasheet
RJP3053DPP-A9#T2F DatasheetCustomer # :
Description : HIGH SPEED IGBT, 300V, 30A
Pricing (USD) : *To apply for a price, please click the Send Target Price button
| Quantity | Unit Price | Total |
| 163+ | $ 1.6650 | $ 271.4 |
In Stock: 38278
MOQ :1 PCS
Packaging :-
Delivery Time :Ship Within 48 Hours
Shipping Origin :Shenzhen or Hong Kong Warehouse
Quantity :
Unit Price :$ 1.665
Total :$ 1.67
Delivery :
Payment :
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RJP3053DPP-A9#T2F information
Rochester Electronics RJP3053DPP-A9#T2F technical specifications, attributes, parameters.
- Category:Discrete Semiconductor Devices/Transistors - IGBTs - Single
- Product Status:Active
- Operating Temperature:-
- Mounting Type:-
- Package / Case:-
- Input Type:-
- Power - Max:-
- Supplier Device Package:-
- Reverse Recovery Time (trr):-
- Current - Collector ( Ic) ( Max):-
- Voltage - Collector Emitter Breakdown ( Max):-
- I G B T Type:-
- Vce(on) ( Max) @ Vge, Ic:-
- Current - Collector Pulsed ( Icm):-
- Switching Energy:-
- Gate Charge:-
- Td (on/off) @ 25° C:-
- Test Condition:-
- EU RoHS Status:RoHS Compliant
- MSL Rating:1 (Unlimited, 30°C/85%RH)
- REACH Status:REACH is not affected
- US ECCN:EAR99
- HTS US:8541.29.0095
- China RoHS Status:Green Symbol: Green and environmentally friendly product
RJP3053DPP-A9#T2F provided by Rochester Electronics
As an original manufacturer stocking distributor,
Rochester Electronics has over 15 billion devices in stock encompassing more than 200,000-part numbers, providing the world’s most extensive range of end-of-life (EOL) semiconductors and broadest range of active semiconductors.
As a licensed semiconductor manufacturer, Rochester has manufactured over 20,000 device types. With over 12 billion die in stock, Rochester has the capability to manufacture over 70,000 device types.
Rochester offers a full range of manufacturing services including Design, Wafer Processing, Assembly, Test, Reliability, and IP Archiving providing single solutions through to full turnkey manufacturing, enabling faster time-to-market.
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